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ATE Boards

ATE Loadboard & Probecard Design

We build the giant, extremely complex circuit boards that factories use to test computer chips and make sure each one works before it ships.

1 min readateloadboardprobecardtest
Outcome

First-pass loadboards that mate to the tester and hold signal integrity across tens of thousands of nets.

Layer count
Up to 110 layers
Net count
40,000+ nets
Contact finish
Hard gold fingers
Simulation
Full electrical / SI-PI

An ATE loadboard is the electrical interface between an automated test system and the device under test. These are among the most demanding PCBs built — extreme layer counts, enormous net counts, and unforgiving signal and power integrity requirements.

Scale we handle

  • Up to 110 layers of routing and plane structure.
  • 40,000+ nets across DUT sites, tester channels, and instrumentation.
  • Multi-site arrays for parallel test throughput.

Signal and power integrity

Loadboards run full electrical simulation before fabrication — there is no cheap respin at this layer count. We model:

  • Channel impedance and crosstalk from the pogo interface to the DUT socket.
  • Power delivery network (PDN) impedance and decoupling for high pin-count devices.
  • Relay, kelvin, and force/sense routing for parametric measurement paths.

Contacts and mechanicals

The tester interface uses gold fingers plated in hard gold (typically 30 µin over nickel) to survive thousands of insertion cycles. We coordinate socket cavities, stiffener plates, and flatness requirements so the board mates reliably to the pogo tower.

FeatureRequirement
Edge contactsHard gold, beveled
FlatnessTester-defined, stiffened
Via strategyBack-drilled stubs
ThermalSockets, heat management
Engineering noteAt 100-plus layers, back-drilling to remove via stubs is essential — an unremoved stub becomes a resonant antenna that corrupts high-speed test measurements.

Every loadboard is delivered with a simulation-backed stackup, a documented net budget, and a fabrication package tuned to the small pool of fabs qualified for this class of work.

Have a board that fits this?

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FAQ

Common questions

Yes. High-layer-count test interface boards (loadboards / DUT boards) are a specialty — including controlled impedance, power integrity, and socket/contactor integration. Probe cards for wafer-level test are a related interface we can advise on.

Standard rigid stacks, HDI builds with sequential lamination and microvias, and specialized ATE loadboards up to 110 layers routing 40,000+ nets. Density, controlled impedance and heavy power in one board are the kind of problem we're built for.

Yes — HDI microvia stackups and via-in-pad, high-density interconnect, and single-ended and differential controlled impedance held to ±5% with test coupons embedded in every panel.

We engineer to IPC-A-600 / IPC-6012 Class 2 and Class 3, verify netlists against IPC-D-356, and support the documentation rigor that regulated aerospace, medical and defense programs require.

See all pre-manufacturing FAQs →